Company:Qualcomm Semiconductor Limited

Job Area:Engineering Group, Engineering Group > Packaging Engineering

Qualcomm Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

General Summary:

Qualcomm’s Hardware Systems organization is seeking a seasoned Thermal Engineer to join our Taiwan team. The qualified individual will be creating innovative solutions resolving complex thermal management challenges supporting Server applications. He/She will apply analytical and empirical skills on the development of advanced thermal architecture solutions for high performance server packages utilized in data center applications.

Responsibilities

Perform package and system-level thermal modeling to maximize thermal performance of various packages.Design, set up, run, and deliver results for various thermal experiments to validate performance of hardware.Manage technical projects and collaborate with other internal organizations and OEMs/ODMs to support the execution process throughout development cycle.Perform thermal simulations and tests and prepare and present results to stakeholders from various disciplines.

Skills and Experience

8+ years of industry experience in electronics cooling preferably related to Server packages and systems.Expertise in conducting CFD simulations utilizing tools such as ANSYS-Icepak, Flotherm, or Celsius-EC.Skillset and hands-on experience to enable test hardware/platforms and execute test vectors for the purpose of thermal validation and verification testing.Ability to write scripts and data analysis. Programming experience with Python, C/C++.Debugging and bring up experience, in addition to operating data acquisition equipment required.Ability to design thermal tests and execute per plan within a laboratory environment.Must have experience with selection of thermal management materials.In-depth understanding of forced convection and liquid cooling. Exposure to cooling systems related to Server industry is a plus.Must have thermal design experience with PCBs, enclosures, and heat sinks.Some experience with 3D geometry CAD tools such as Solidworks or Creo.Excellent presentation, negotiation, and communication skills.

Education Requirements

MSME or PhD in Mechanical Engineering

Keywords

Server, data center, server packages, Heat transfer, CFD, ANSYS-Icepak, Flotherm, Celsius-EC, thermal management, thermal test, fans, natural convection, forced convection, radiation, conduction, liquid cooling.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail myhr.support@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.

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